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SMDLTLFP500T3C

5S-SMDLTLFP500T3C
Chip Quik Inc.
SMDLTLFP500T3C
SOLDER PASTE LOW TEMP T3 500G
In stock
SMDLTLFP500T3C Datasheet
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Product Description
Packaging:-
Type:Solder Paste
Melting Point:281??????F (138??????C)
Process:Lead Free
Composition:Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Flux Type:No-Clean
Diameter:-
Wire Gauge:-
Core Size:-
Form:-
Shelf Life:6 Months (Date of Manufacture) (Refrigerated)
Other:,,
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