B660B-0.0055-00-1112-NA

5S-B660B-0.0055-00-1112-NA
B660B-0.0055-00-1112-NA
BOND PLY 660B 11X12
In stock
L/C, T/T, Western Union, Paypal
Shipping Immediately ASAP
Product Description
Series:Bond-Ply? 660B
Usage:Sheet
Shape:Rectangle
Outline:304.80mm x 279.40mm
Thickness:0.0055 (0.140mm)
Material:Non-Silicone
Adhesive:Polyethylene-Naphthalate (PEN)
Backing:Adhesive - Both Sides
Carrier:Polyethylene-Naphthalate (PEN)
Color:White
Thermal Resistivity:0.58??????C/W
Thermal Conductivity:0.4 W/m-K
Other:,,
Related special

  • BQ51013BRHLR
  • Texas Instruments
  • Wireless Power Receiver PMIC 20-VQFN (3.5x4.5)
  • In stock
  • B2B-PH-K-S
  • JST
  • Connector Header Through Hole 2 position 0.079" (2.00mm)
  • In stock
  • B06B-PNISK-1A
  • JST
  • Connector Header Through Hole 6 position 0.079" (2.00mm)
  • In stock
  • BF3F-71GF-P2.0
  • JST
  • JST JFA connector J-PF3 press fit type Terminal
  • In stock
  • BU21010MUV-E2
  • Rohm Semiconductor
  • IC CTLR CAP SENSOR 8CH 16VQFN
  • In stock
  • BU21050FS-E2
  • Rohm Semiconductor
  • IC CAP SENSOR SWITCH 8CH 32-SSOP
  • In stock
  • BU21050FS-E2
  • Rohm Semiconductor
  • IC CAP SENSOR SWITCH 8CH 32-SSOP
  • In stock