LTN20069

5S-LTN20069
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
In stock
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Product Description
Series:Penguin
Type:Board Level
Package Cooled:Assorted (BGA
Attachment Method:LGA
Shape:CPU
Length:ASIC...)
Width:Thermal Tape
Diameter:Adhesive (Included)
Height Off Base (Height of Fin):Square
Power Dissipation @ Temperature Rise:Fins
Thermal Resistance @ Forced Air Flow:0.650 (16.51mm)
Thermal Resistance @ Natural:0.653 (16.59mm)
Material:-
Material Finish:0.350 (8.89mm)
Other:-,8??????C/W @ 500 LFM,-,Aluminum
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