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BDN11-3CB/A01

5S-BDN11-3CB/A01
BDN11-3CB/A01
HEATSINK CPU W/ADHESIVE 1.11SQ
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Product Description
Series:BDN
Type:Top Mount
Package Cooled:Assorted (BGA
Attachment Method:LGA
Shape:CPU
Length:ASIC...)
Width:Thermal Tape
Diameter:Adhesive (Included)
Height Off Base (Height of Fin):Square
Power Dissipation @ Temperature Rise:Pin Fins
Thermal Resistance @ Forced Air Flow:1.110 (28.19mm)
Thermal Resistance @ Natural:1.110 (28.19mm)
Material:-
Material Finish:0.355 (9.02mm)
Other:-,7.2??????C/W @ 400 LFM,20.9??????C/W,Aluminum
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