658-25AB

5S-658-25AB
658-25AB
HEATSINK CPU 28MM SQ BLK
In stock
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Product Description
Series:658
Type:Top Mount
Package Cooled:BGA
Attachment Method:Thermal Tape
Shape:Adhesive (Not Included)
Length:Square
Width:Pin Fins
Diameter:1.100 (27.94mm)
Height Off Base (Height of Fin):1.100 (27.94mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:0.250 (6.35mm)
Thermal Resistance @ Natural:2W @ 40??????C
Material:5??????C/W @ 500 LFM
Material Finish:-
Other:Aluminum,Black Anodized,,
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