609-50ABS3

5S-609-50ABS3
609-50ABS3
HEATSINK FOR POWERPC CPU BLK
In stock
L/C, T/T, Western Union, Paypal
Shipping Immediately ASAP
Product Description
Series:609
Type:Top Mount
Package Cooled:Assorted (BGA
Attachment Method:LGA
Shape:CPU
Length:ASIC...)
Width:Clip
Diameter:Thermal Material
Height Off Base (Height of Fin):Rectangular
Power Dissipation @ Temperature Rise:Pin Fins
Thermal Resistance @ Forced Air Flow:2.895 (73.53mm)
Thermal Resistance @ Natural:2.000 (50.80mm)
Material:-
Material Finish:0.500 (12.70mm)
Other:-,2.5??????C/W @ 250 LFM,-,Aluminum
Related special

  • 640445-4
  • TE Connectivity
  • Connector Header Through Hole 4 position 0.156" (3.96mm)
  • In stock
  • 640445-9
  • TE Connectivity
  • Connector Header Through Hole 9 position 0.156" (3.96mm)
  • In stock
  • 63819-1500
  • Molex
  • TOOL HAND CRIMPER 28-32AWG SIDE
  • In stock
  • 640456-4
  • TE Connectivity AMP Connectors
  • Connector Header Through Hole 4 position 0.100" (2.54mm)
  • In stock
  • 65440R
  • Echelon Corporation
  • IZOT U60 FT NETWORK INTERFACE MO
  • In stock
  • 602-ND
  • SCC68692E1N40
  • 602
  • In stock
  • 602-ND
  • SCC68692C1N40
  • 602
  • In stock
  • 602-ND
  • SCC2692AE1N28
  • 602
  • In stock
  • 602-ND
  • SCC2692AE1N40
  • 602
  • In stock
  • 664GI-01LF
  • IDT
  • Integrated Device Technology Inc
  • In stock
  • 664G-02LFT
  • IDT
  • Integrated Device Technology Inc
  • In stock
  • 664G-03LFT
  • IDT
  • Integrated Device Technology Inc
  • In stock
  • 664G-01LFT
  • IDT
  • Integrated Device Technology Inc
  • In stock
  • 660GILFT
  • IDT
  • Integrated Device Technology Inc
  • In stock