573100D00000G

5S-573100D00000G
573100D00000G
TOP MOUNT HEATSINK .4 D-PAK
In stock
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Product Description
Series:-
Type:Top Mount
Package Cooled:TO-252 (DPak)
Attachment Method:SMD Pad
Shape:Rectangular
Length:0.315 (8.00mm)
Width:0.900 (22.86mm)
Diameter:-
Height Off Base (Height of Fin):0.400 (10.16mm)
Power Dissipation @ Temperature Rise:0.75W @ 30??????C
Thermal Resistance @ Forced Air Flow:12.5??????C/W @ 600 LFM
Thermal Resistance @ Natural:15??????C/W
Material:Copper
Material Finish:Tin
Other:,,,
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