530101B00150G

5S-530101B00150G
530101B00150G
HEATSINK 1.75 HI RISE TO-218
In stock
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Product Description
Series:-
Type:Board Level
Package Cooled:Vertical
Attachment Method:TO-218
Shape:Clip and Board Mounts
Length:Square
Width:Fins
Diameter:1.750 (44.45mm)
Height Off Base (Height of Fin):0.490 (12.44mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:1.750 (44.45mm)
Thermal Resistance @ Natural:4W @ 30??????C
Material:1.5??????C/W @ 400 LFM
Material Finish:6.3??????C/W
Other:Aluminum,Black Anodized,,
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