335214B00032G

5S-335214B00032G
335214B00032G
BGA HEAT SINK
In stock
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Product Description
Series:-
Type:Top Mount
Package Cooled:BGA
Attachment Method:Thermal Tape
Shape:Adhesive (Included)
Length:Square
Width:Fins
Diameter:0.985 (25.02mm)
Height Off Base (Height of Fin):0.985 (25.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:0.390 (9.91mm)
Thermal Resistance @ Natural:-
Material:5.3??????C/W @ 200 LFM
Material Finish:10??????C/W
Other:Aluminum,Black Anodized,,
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