BU200Z-178-HT

5S-BU200Z-178-HT
BU200Z-178-HT
CONN IC DIP SOCKET 20POS GOLD
In stock
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Product Description
Packaging:Tube
Series:BU-178HT
Type:DIP
Number of Positions or Pins (Grid):0.3 (7.62mm) Row Spacing
Pitch - Mating:20 (2 x 10)
Contact Finish - Mating:0.100 (2.54mm)
Contact Finish Thickness - Mating:Gold
Contact Material - Mating:78.7??????in (2.00??????m)
Mounting Type:Beryllium Copper
Features:Surface Mount
Termination:Open Frame
Pitch - Post:Solder
Contact Finish - Post:0.100 (2.54mm)
Contact Finish Thickness - Post:Copper
Contact Material - Post:Flash
Housing Material:Brass
Operating Temperature:Polybutylene Terephthalate (PBT)
Other:Glass Filled,-55??????C ~ 125??????C,
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