40-8435-310C

5S-40-8435-310C
40-8435-310C
CONN IC DIP SOCKET 40POS GOLD
In stock
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Product Description
Packaging:Bulk
Series:8
Type:DIP
Number of Positions or Pins (Grid):0.3 (7.62mm) Row Spacing
Pitch - Mating:40 (2 x 20)
Contact Finish - Mating:0.100 (2.54mm)
Contact Finish Thickness - Mating:Gold
Contact Material - Mating:30??????in (0.76??????m)
Mounting Type:Beryllium Copper
Features:Through Hole
Termination:Closed Frame
Pitch - Post:Elevated
Contact Finish - Post:Solder
Contact Finish Thickness - Post:0.100 (2.54mm)
Contact Material - Post:Gold
Housing Material:10??????in (0.25??????m)
Operating Temperature:Brass
Other:Polyamide (PA46),Nylon 4/6,Glass Filled
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