40-526-11

5S-40-526-11
40-526-11
CONN IC DIP SOCKET ZIF 40POS GLD
In stock
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Product Description
Packaging:Bulk
Series:Lo-PRO?file
Type:Active
Number of Positions or Pins (Grid):DIP
Pitch - Mating:ZIF (ZIP)
Contact Finish - Mating:40 (2 x 20)
Contact Finish Thickness - Mating:0.100 (2.54mm)
Contact Material - Mating:Gold
Mounting Type:10??????in (0.25??????m)
Features:Beryllium Copper
Termination:Through Hole
Pitch - Post:Closed Frame
Contact Finish - Post:Solder
Contact Finish Thickness - Post:0.100 (2.54mm)
Contact Material - Post:Gold
Housing Material:10??????in (0.25??????m)
Operating Temperature:Beryllium Copper
Other:Polyamide (PA46),Nylon 4/6,Glass Filled
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