32-6554-11

5S-32-6554-11
32-6554-11
CONN IC DIP SOCKET ZIF 32POS GLD
In stock
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Product Description
Packaging:Bulk
Series:55
Type:DIP
Number of Positions or Pins (Grid):ZIF (ZIP)
Pitch - Mating:0.6 (15.24mm) Row Spacing
Contact Finish - Mating:32 (2 x 16)
Contact Finish Thickness - Mating:0.100 (2.54mm)
Contact Material - Mating:Gold
Mounting Type:-
Features:Beryllium Copper
Termination:Through Hole
Pitch - Post:Closed Frame
Contact Finish - Post:Solder
Contact Finish Thickness - Post:0.100 (2.54mm)
Contact Material - Post:Gold
Housing Material:-
Operating Temperature:Beryllium Copper
Other:Polyphenylene Sulfide (PPS),Glass Filled,-
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