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3-1571550-2

5S-3-1571550-2
3-1571550-2
CONN IC DIP SOCKET 40POS GOLD
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Product Description
Packaging:Tube
Series:500
Type:DIP
Number of Positions or Pins (Grid):0.6 (15.24mm) Row Spacing
Pitch - Mating:40 (2 x 20)
Contact Finish - Mating:0.100 (2.54mm)
Contact Finish Thickness - Mating:Gold
Contact Material - Mating:25??????in (0.63??????m)
Mounting Type:Beryllium Copper
Features:Through Hole
Termination:Closed Frame
Pitch - Post:Solder
Contact Finish - Post:0.100 (2.54mm)
Contact Finish Thickness - Post:Gold
Contact Material - Post:25??????in (0.63??????m)
Housing Material:Beryllium Copper
Operating Temperature:Polycyclohexylenedimethylene Terephthalate (PCT)
Other:Polyester,-55??????C ~ 125??????C,
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