08-2513-10

5S-08-2513-10
08-2513-10
CONN IC DIP SOCKET 8POS GOLD
In stock
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Product Description
Packaging:Bulk
Series:Lo-PRO?file
Type:Active
Number of Positions or Pins (Grid):DIP
Pitch - Mating:0.2 (5.08mm) Row Spacing
Contact Finish - Mating:8 (2 x 4)
Contact Finish Thickness - Mating:0.100 (2.54mm)
Contact Material - Mating:Gold
Mounting Type:10??????in (0.25??????m)
Features:Beryllium Copper
Termination:Through Hole
Pitch - Post:Closed Frame
Contact Finish - Post:Solder
Contact Finish Thickness - Post:0.100 (2.54mm)
Contact Material - Post:Tin
Housing Material:200??????in (5.08??????m)
Operating Temperature:Brass
Other:Polyamide (PA46),Nylon 4/6,Glass Filled
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